via

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vi·a

 (vī′ə, vē′ə)
prep.
1. By way of: went to Pittsburgh via Philadelphia.
2. By means of: sent the letter via airmail.
[Latin viā, ablative of via, road; see wegh- in Indo-European roots.]
American Heritage® Dictionary of the English Language, Fifth Edition. Copyright © 2016 by Houghton Mifflin Harcourt Publishing Company. Published by Houghton Mifflin Harcourt Publishing Company. All rights reserved.

via

(ˈvaɪə)
prep
by way of; by means of; through: to London via Paris.
[C18: from Latin viā, from via way]
Collins English Dictionary – Complete and Unabridged, 12th Edition 2014 © HarperCollins Publishers 1991, 1994, 1998, 2000, 2003, 2006, 2007, 2009, 2011, 2014

vi•a

(ˈvaɪ ə, ˈvi ə)

prep.
1. by a route that touches or passes through; by way of.
2. by the agency or instrumentality of; by means of: to communicate via sign language.
[1770–80; < Latin viā, abl. of via way]
Random House Kernerman Webster's College Dictionary, © 2010 K Dictionaries Ltd. Copyright 2005, 1997, 1991 by Random House, Inc. All rights reserved.
ThesaurusAntonymsRelated WordsSynonymsLegend:

via

preposition
1. through, by way of, by, by means of Mr Baker will return home via Britain and France.
2. using, by means of, with the help of Translators can now work via e-mail.
Collins Thesaurus of the English Language – Complete and Unabridged 2nd Edition. 2002 © HarperCollins Publishers 1995, 2002
Translations
عَنْ طَرِيقعَن طَريق
přes
via
kautta
preko
um, meî viîkomu á
･･･経由でで
...을 거쳐
caur
prek
via
โดยทาง
yoluyla-den/dan geçerek
qua

via

[ˈvaɪə] PREP → por; (esp by plane) → vía
we drove to Lisbon via Salamanca → fuimos a Lisboa por Salamanca
a flight via Brussels → un vuelo vía Bruselas
Collins Spanish Dictionary - Complete and Unabridged 8th Edition 2005 © William Collins Sons & Co. Ltd. 1971, 1988 © HarperCollins Publishers 1992, 1993, 1996, 1997, 2000, 2003, 2005

via

[ˈvaɪə ˈviːə] prep
(= through) → via
We went to Paris via Boulogne → Nous sommes allés à Paris via Boulogne.
(= by means of) → par
They can work from home, via e-mail → Ils peuvent travailler de chez eux, par e-mail.
Collins English/French Electronic Resource. © HarperCollins Publishers 2005

via

prep → über (+acc); (with town names also) → via; they got in via the window → sie kamen durchs Fenster herein
Collins German Dictionary – Complete and Unabridged 7th Edition 2005. © William Collins Sons & Co. Ltd. 1980 © HarperCollins Publishers 1991, 1997, 1999, 2004, 2005, 2007

via

[ˈvaɪə] prep (by way of, place) → via; (person) → attraverso, tramite; (by means of) → tramite, attraverso, per mezzo di
Collins Italian Dictionary 1st Edition © HarperCollins Publishers 1995

via

(ˈvaiə) preposition
by way of. We went to America via Japan; The news reached me via my aunt.
Kernerman English Multilingual Dictionary © 2006-2013 K Dictionaries Ltd.

via

→ عَنْ طَرِيق přes via über μέσω vía kautta via preko attraverso ･･･経由で ...을 거쳐 via via przez via через via โดยทาง yoluyla qua 经由
Multilingual Translator © HarperCollins Publishers 2009

vi·a

n. L. vía, tracto, conducto.
English-Spanish Medical Dictionary © Farlex 2012
Mentioned in ?
References in periodicals archive ?
Check-out our latest range of microfabricated SiPM arrays with TSV (through-silicon via) and HWB (hole wire bond) technologies.
MPPC[R]/SiPM--the ultimate detector
Silicon interposers with through-silicon via (TSV) are now mature products for high-performance applications, as indicated in several presentations.
ECTC Boasts Record Crowds, FO-WLP Sessions Overflow: Whether round or rectangle, HDI will be required to meet the needs of next-generation semiconductor nodes
But the move to wafer-level packaging, Aji said, inserts between the front end and the back end a new middle-of-the-line or "middle-end" stage, involving wafer-level through-silicon via (TSV), electrical redistribution layer (RDL), and bumping operations, with bump size and pitch decreasing, RDL line/space shrinking, and use of TSVs increasing.
Inspection systems address 'middle-end' semiconductor processes
The 3D ICs that are discussed in this report are developed by using through-silicon via (TSV) interconnect technology.
"Global 3D IC Market 2014-2018" Published

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