JEP30: PartModel Guidelines

JEP30 and its related documents are currently published and maintained as a JEDEC-wide project between the JC-11, JC-14, JC-15 and JC-16 Committees. JEP30 establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products. For example, JEP30 could be used to define a part in sufficient detail to enable process efficiencies during the part and product life cycles, i.e., design, purchasing, manufacturing, quality control, test, material deceleration, supply chain, etc. JEP30 is designed to be scalable insofar that it covers as many components as possible including the emergence of new parts in the future.

A groundbreaking collaboration between the Open Compute Project Foundation (OCP) and JEDEC merges the capabilities and open standards of OCP’s Chiplet Data Extensible Markup Language (CDXML) into JEP30. The initial phase of the integration expanded the capability of the PartModel to enable chiplet builders to provide standardized chiplet part descriptions to their customers electronically and opened the door to automating System in Package (SiP) design and assembly using chiplets. The chiplet descriptions encompass crucial information for SiP builders, including thermal properties, physical and mechanical requirements, behavior specifications, power and signal integrity properties, testing in-package and security parameters.

The February 2024 release extended the collaboration by enhancing the PartModel to represent Die-Arrays, scalable to support multiple depths of hierarchical nested arrays and billions of bumps intended to support the industry for decades to come.  In February 2025, JEDEC and OCP announced the addition of new Chiplet Design Kits for use with today's EDA tools covering Assembly, Substrate, Material and Test to the PartModel.

JEP30 covers the parental structure for the assembly process classification, electrical, physical, thermal, material deceleration, supply chain including product change notice and product discontinuance data. The parent schema file is JEP30-10, PartModel XML Schema.

Users should review the Terms & Conditions of Use before using any aspect of JEP30: https://www.jedec.org/jedec-partmodels-terms-of-use, and are advised that JEDEC PartModels are copyrighted by JEDEC and may not be reproduced without permission.

Users can validate their PartModel.xml files against the JEP30-10 Schema here: https://www.jedec.org/sites/default/files/jep30partmodel/10v9-0-2/JEP30-10v9-0-2.xsd.

Users can incorporate the PartModel schema or any of its sub-sections within their schemas by obtaining a direct link to these schemas here.

The following table shows the PartModel schema parent files associated with each sub-section technical schema. The Schema Types Dictionary (JEP30-D10) is a shared schema across all the other schema.

DocumentTitlePub. DateXML Schema FileSchema Version
JEP30G.01PartModel Guidelines for Electronic-Device Packages - XML Requirements12/2025JEP30-10Ver 9-0-2
JEP30-A100B.02PartModel Assembly Process Classification Guidelines for Electronic-Device Packages - XML Requirements9/2025JEP30-A101Ver 2-1-3
JEP30-E100IPartModel Electrical Guidelines for Electronic-Device Packages - XML Requirements9/2025JEP30-E101Ver 6-0-2
JEP30-P100HPartModel Package Guidelines for Electronic-Device Packages - XML Requirements9/2025JEP30-P101Ver 9-0-2
JEP30-S100BPartModel Supply Chain Guidelines for Electronic-Device Packages - XML Requirements9/2025JEP30-S101Ver 2-0-2
JEP30-T100CPartModel Thermal Guidelines for Electronic-Device Packages - XML Requirements9/2025JEP30-T101Ver 3-0-2
JEP30-K100A

PartModel Design Rule Kits Guidelines for Electronic-Device Packages – XML Requirements

9/2025JEP30-K101Ver 2-0-2
JEP30-M100A

PartModel Generated ECAD - Models Guidelines for Electronic-Device Packages – XML Requirements

9/2025JEP30-M101Ver 1-1-3
JEP30-PX100PartModel Product Guidelines for Electronic-Device Substrates and Assemblies – XML Requirements9/2025JEP30-PX101Ver 1-0-2
 PartModel Schema Types Dictionary9/2025JEP30-D10Ver 6-0-2

*All subschemas are released under the umbrella of the Part Model Schema to ensure that the Part Model Schema is referencing the correct version of the subschema. In addition, this enables the subschema to connect to the Manufacturer Part Number and the Manufacturer of the Part.

Previous versions of the PartModel can be accessed here.


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