Ancey, "Process and RF modelling of TSV last approach for 3D RF
interposer," Proc.
Interposers, on the other hand, allow designers to integrate existing chips side-by-side on an interconnecting surface, analogous to a circuit card but offering a significant performance advantage.
The inherent advantages of direct liquid cooling are well established: It provides high heat transfer rates directly at the chip surface while avoiding the detrimental effects of contact resistance encountered with
interposers. Nevertheless, additional research and development will be required to support the detailed design and optimization of such two-phase microfluidic cooling systems.
Interposer support for DIMMs (The solution supports a 240-pin, 933 MHz clock (1866 MT/s data rate), 64-/72-bit, Un-buffered Synchronous Double Date Rate 3 DRAM Dual In-Line Memory Module (DDR3 SDRAM DIMM);
Many companies see potential promise for glass as a low-cost
interposer solution for the future and are involved in the research at Georgia Tech, Fraunhofer, KAIST, ITR1, and other research organizations.
By applying the newly-developed micro hole drilling processing technology for ultra-thin glass to process glass
interposers, AGC will be able to drill holes precisely and at high speed to connect through-electrodes.
The new FS2352B DDR3 DIMM 2133
Interposer is priced at USD35,000.
LeCroy Corporation, Santa Clara, Calif., a supplier of oscilloscopes and serial data test solutions, has introduced a new Mini Card
Interposer for the Summit(TM) PCI Express Protocol Analyzer product line.
-- HSMC and FMC
interposer cards: www.ti.com/hsmcadc-pr and www.ti.com/fmcadc-pr
In addition, the Aficio MP 5500/MP 6500/MP 7500 Series enables users to create professional documents effortlessly with advanced finishing options such as a cover
interposer, a 100-sheet staple finisher, a booklet finisher, a Z-fold unit that cuts down over-sized documents to a more convenient size, and a two or three-hole punch unit.
Intel had originally developed the EMIB as an alternative to what's known as a silicon
interposer, the "floor" or "foundation" of a multichip module.
Teledyne LeCroy introduced several new products, including the HDA125 high-speed digital analyzer for its oscilloscope line, an
interposer probe for analysis of PCIe External Cable 3.0 ports that utilize the new PCI Express External Cabling Specification Revision 3.0, and the Power Delivery Compliance Suite for the Voyager M310C SuperSpeed USB 3.1 protocol verification platform.
"Parametric Fault Testing and Performance Characterization of Post-Bond
Interposer Wires in 2.5-D ICs"
