File:TPU v4.png
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Summary
| Description |
English: The TPU v4 package (ASIC in center plus 4 HBM
stacks) and printed circuit board (PCB) with 4 liquid-cooled packages. The board's front panel has 4 top-side PCIe connectors and 16 bottom-side OSFP connectors for inter-tray ICI links. |
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| Date | ||||
| Source | https://arxiv.org/ftp/arxiv/papers/2304/2304.01433.pdf | |||
| Author |
Norman P. Jouppi, George Kurian, Sheng Li, Peter Ma, Rahul Nagarajan, Lifeng Nai, Nishant Patil, Suvinay Subramanian, Andy Swing, Brian Towles, Cliff Young, Xiang Zhou, Zongwei Zhou, and David Patterson |
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| Permission (Reusing this file) |
https://arxiv.org/abs/2304.01433 | |||
| Other versions |
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Licensing
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 12:04, 6 April 2023 | | 2,048 × 1,536 (2.68 MB) | Shizhao | Uploaded a work by Norman P. Jouppi, George Kurian, Sheng Li, Peter Ma, Rahul Nagarajan, Lifeng Nai, Nishant Patil, Suvinay Subramanian, Andy Swing, Brian Towles, Cliff Young, Xiang Zhou, Zongwei Zhou, and David Patterson from https://arxiv.org/ftp/arxiv/papers/2304/2304.01433.pdf with UploadWizard |
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